The LCD laser cutting machine is used for the cutting and processing of display glass for mobile phones, computers, and LCD screens.
Laser cutting of glass substrates is a complex process of laser-material interaction. This process includes transient heat conduction where the laser moving heat source heats the material, changes in the temperature field gradient to generate thermal stress, and using thermal stress to induce crack propagation until fracture, thereby dividing the glass substrate.
The equipment is mainly designed for tray loading and unloading, picosecond laser cutting, optical path design, and magnetic wheel transmission mechanisms. It includes SW2018 editable version, converted to STEP, and has been successfully used in normal production at BOE and Tianma facilities.
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